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August 28, 2008--Aries Electronics' CSP/MicroBGA test and burn-in socket accommodates devices of up to 6.5-mm squared, and is suited for use with test and burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash devices.
The socket offers solderless pressure-mount compression spring probes, which can be accurately located by two molded plastic alignment pins and mounted with two stainless steel screws. This allows the sockets to be easily mounted to and removed from the burn-in-board (BIB). It also features a pressure pad compression spring that provides proper force against the device, and allows for height variations in device thickness. In addition, the gold over nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls.
This device accommodates up to 500,000 cycles and operates at a temperature of -55° to 150° C (-67° to 302° F). Sockets are comprised of spring probes with contact forces of 15 g per contact on 0.30 to 0.35 mm pitches, 16 g per contact on 0.40 to 0.45 mm pitches, 25 g per contact on 0.50 to 0.75 mm pitches, and 25 g per contact on an 0.80 mm pitch or larger. Spring probes are heat-treated beryllium copper alloy plated with 30 µ min. (.75 µ) gold per MIL-G-45204 over 30 µ min. (.75 µm) nickel per SAE-AMS-QQ-N-290. Molded components are UL94V-0 Ultem and machined components are UL94V-0 PEEK or Torlon. All hardware is stainless steel.
The test socket is available in custom materials, platings, sizes and configurations to suit specific applications. Pricing for a 100 lead socket starts at $200. Delivery is 20 working days ARO.
On the Web: www.arieselec.com
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