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July 11, 2008 -- W. L. Gore & Associates recently introduced an online builder for configuring the GORE Ultra High Density (UHD) interconnects to use in applications including bench-top test systems, instrument probe cables, parallel data links, production floor equipment, and automated test equipment.
The company says its Ultra High Density (UHD) interconnects are designed to provide an integrated system of board mount headers and ganged assemblies with reliable signal integrity performance. Cost savings are achieved through shorter test setup, fewer calibrations, and smaller boards, maintains the company. The company contends that its UHD interconnects enable lower loss, lower skew, better impedance control, and shorter board trace lengths.
Gore's Ultra High Density Interconnect Builder is available at www.gore.com/uhdbuilder. The company's low loss UHD cable assemblies utilize its proprietary low loss coaxial cable, made using ePTFE dielectric, with UHD-S, UHD-P, and SMA-P connectors. For additional bandwidth, the company's high frequency UHD cable assemblies utilize its proprietary ultra-low loss coaxial cable and precision UHD connectors to achieve performance up to 15 GHz, supporting up to 10 Gigabit data rates.
The GORE UHD cable assemblies are available as single lines or ganged into 2-, 4-, or 8-position housings that allow easier handling, quick connect and disconnect, and better cable management. A 10pS relative time match is standard for all ganged UHD cable assemblies.
On the Web:
www.gore.com
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