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Tyco expands high density backplane line

July 7, 2008 -- Tyco Electronics has added a 6-pair module to its Z-PACK TinMan backplane product portfolio. The 6-pair module offers 80 differential pairs per inch fitting within a 1.15" card slot pitch. The module is aimed at customers looking to implement extremely high density backplane interconnect systems.

According to the company, the 6-pair module features 12+ Gbit/sec performance, a fully protected right-angle receptacle for use on daughtercards, and field reparability at the module or single pin levels. Additionally, low crosstalk and high throughput performance are achieved by positioning ground contacts within each column along with unique contact lead frame placements.

Samples are available upon request, says the company.




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