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April 28, 2008 -- Tyco Electronics announced that it is now offering the Impact backplane connector system.
Tyco Electronics and Molex have entered into a second sourcing supplier agreement for the Impact product line. The companies say they will leverage their global manufacturing capabilities to offer intermateable, interchangeable, interoperable backplane connector solutions. This agreement follows a previous second sourcing agreement in which Molex agreed to second source Tyco Electronics' Z-PACK TinMan connector family.
The Impact backplane connector system is designed for increased speed and density to meet the future system upgrades and next generation requirements of data networking and telecommunications equipment. Initial parts will be available beginning mid-2008 with typical production delivery within 6 to 8 weeks.
The connector is designed to provide 20+ Gbit/sec performance and will be offered in a variety of connector module sizes and types including 3-pair, 4-pair, 5-pair and 6-pair modules. Density within the connector system ranges from 40 contact pairs per inch to 80 contact pairs per inch, and header widths from 16.70 mm to 28.85 mm.
"Tyco Electronics is excited to add this connector system to our already broad product portfolio of high speed products," comments Robert Hnatuck, Tyco Electronics' product manager. "We realize applications can vary from customer to customer and from one design to the next. Offering choices to our customers is a key strategy and one of our strengths. We also understand the market's demand for multiple sourcing, and this product reflects Tyco Electronics commitment to that strategy."
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